The KEXINT MMC Elite Single-Mode Female Connector Kit (Compatible with US Conec 24889) is a premier Very Small Form Factor (VSFF) solution engineered for the extreme density requirements of modern AI clusters and High-Performance Computing (HPC) environments. Designed to provide 3x the cabling density of standard MTP/MPO connectors, this Elite-grade kit enables seamless transitions to 400G, 800G, and beyond.
Product Description
As AI clusters and High-Performance Computing (HPC) environments scale toward 800G and 1.6T, traditional connectivity becomes the bottleneck. The KEXINT MMC Elite Single-Mode Female Connector Kit is a Very Small Form Factor (VSFF) masterpiece designed to deliver 3x the cabling density of standard MTP/MPO solutions.
This Elite-grade kit is engineered for technicians who demand high-speed reliability and ease of use in highly congested rack environments. With its innovative Push-Pull technology, it solves the "finger-access" challenge in high-density patch panels, ensuring your infrastructure is future-proof and scalable.
Product Highlights
1. 300% Higher Cabling Density: The Very Small Form Factor (VSFF) design provides 3x the density of standard MTP/MPO connectors, allowing you to maximize rack unit (U) utilization in hyperscale environments.
2. Elite-Grade Low Loss Performance: Precision-engineered Elite ferrules ensure industry-leading low insertion loss and superior return loss, maintaining critical signal integrity for 400G, 800G, and 1.6T high-speed links.
3. Ergonomic Push-Pull Technology: Features a 28mm (1.10") DirectConec™ style push-pull boot, enabling effortless, tool-less installation and removal even in the most congested, ultra-high-density patch panels.
4. Seamless Industry Compatibility: Fully compatible with US Conec P/N 24889 specifications, serving as a high-performance, cost-effective drop-in replacement or OEM solution for North American engineering projects.
5. Optimized for AI GPU Clusters: Engineered to handle the extreme I/O demands of AI infrastructure and Spine-Leaf architectures, providing the physical layer reliability needed for next-generation data center scaling.
6. Rugged Round Cable Support: Specifically designed to accommodate Ø 1.6mm to 2.0mm (0.063" to 0.079") round cables, the durable green housing provides superior mechanical stability and standardized polarity management.
Features
1. Unprecedented Cabling Density with VSFF Architecture
Detailed Description: The KEXINT MMC Elite leverages advanced Very Small Form Factor (VSFF) technology to deliver three times the cabling density of industry-standard MTP/MPO connectors. This significant reduction in physical footprint allows data center operators to maximize rack unit (RU) utilization, facilitating the seamless scaling of network capacity in Spine-Leaf and high-density optical switching fabrics. By accommodating more fibers in less space, it directly reduces CAPEX associated with rack space and physical data center real estate.

2. Ergonomic Push-Pull Boot for Rapid Maintenance
Description: The specialized 28mm black textured boot enables fast, tool-less installation and removal in congested panels. This ergonomic design reduces Mean Time To Repair (MTTR) by up to 50% and minimizes accidental disturbance to adjacent fibers.
3. Purpose-Built for AI GPU Clusters
Description: Engineered to withstand the relentless I/O workloads of AI GPU clusters and HPC, the MMC Elite provides the physical layer reliability needed for massive data throughput. It ensures consistent, high-bandwidth connectivity across evolving compute fabrics.

Specification
| Parameter | Specification | Test Condition |
| Insertion Loss (IL) | ≤ 0.25 dB (Typical); ≤≤ 0.35 dB (Max) | Per IEC 61300-3-4 |
| Return Loss (RL) | ≥ 65 dB (APC) | Per IEC 61300-3-6 |
| Fiber Count | 12 Fibers | Multi-fiber MT-style ferrule |
| Wavelength | 1310nm / 1550nm | Single-mode application |
| Feature | Specification (Metric / Imperial) | Notes |
| Connector Style | MMC Sr. (VSFF) | Very Small Form Factor |
| Gender | Female (No Pins) | Optimized for patch panel mating |
| Housing Color | Green | RAL 6018 (SM APC Identification) |
| Boot Length | 28.0 mm / 1.10 in | DirectConec™ Push-Pull Boot |
| Cable Compatibility | ∅ 1.6 mm - 2.0 mm / 0.063 - 0.079 in | Round cable support |
| Mating Durability | 200 Matings | < 0.2 dB change |
| Cable Retention | 66.7 N / 15.0 lbf | @ 0∘∘ pull |
| Parameter | Operating Range |
| Operating Temperature | -40 ∘∘C to +75 ∘∘C (-40 ∘∘F to +167 ∘∘F) |
| Storage Temperature | -40 ∘∘C to +85 ∘∘C (-40 ∘∘F to +185 ∘∘F) |
| Compliance | RoHS, REACH, UL 94V-0 (Flammability) |
| KEXINT P/N | Description |
| KX-MMC-F-SM-28 | MMC Elite Female Kit, Single-Mode, Green Housing, 28mm Push-Pull Boot |
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