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A high-tech enterprise specializing in the research and development of optical fiber communications and manufacturing.
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A high-tech enterprise specializing in the research and development of optical fiber communications and manufacturing.
KEXINT introduces the MMC Male Single-Mode Elite Connector Kit, a cutting-edge Very Small Form Factor (VSFF) solution engineered to meet the extreme density requirements of next-generation AI data centers and 800G optical networks. This kit, fully compatible with the US Conec MMC platform (P/N 24890), features advanced 12-fiber TMT ferrule technology that delivers three times the cabling density of standard MTP®/MPO connectors.
Designed with a high-performance Green Housing to signify Single-mode Elite specifications, it ensures ultra-low insertion loss and high return loss for critical high-speed links. The integration of the 28mm DirectConec™ Push-Pull boot allows for effortless insertion and removal in ultra-high-density patch panels where finger access is limited, eliminating the need for specialized extraction tools. Whether you are scaling an AI/ML cluster or upgrading hyperscale infrastructure, the KEXINT MMC kit provides the mechanical reliability and optical precision needed to solve I/O bottlenecks and maximize rack-space ROI. Its robust design is optimized for Ø 1.6mm to 2.0mm round cables, making it the ideal choice for high-density trunking and structured cabling environments.
Product Description
The KEXINT MMC Male Single-Mode Elite Connector Kit represents the next generation of Very Small Form Factor (VSFF) optical interconnects. Specifically designed to support 400G, 800G, and 1.6T high-density cabling, the MMC connector provides 3x the density of standard MPO/MTP® interfaces.
Featuring the industry-leading TMT Ferrule and DirectConec™ Push-Pull technology, this kit (equivalent to US Conec 24890) is the definitive solution for overcoming I/O bottlenecks in AI/ML clusters and hyperscale data center architectures.
Product Highlights
1. Triple Data Density – Deliver 3X the fiber count of standard MPO in the same rack space.
2. 800G AI-Ready Performance – Engineered for high-bandwidth AI/ML clusters and next-gen 1.6T networks.
3. Ultra-Low Loss Elite Optics – Single-mode Elite ferrule ensures superior signal integrity and low insertion loss.
4. Tool-Less Push-Pull Patching – DirectConec™ boot enables effortless handling in ultra-high-density panels.
5. Next-Gen VSFF Innovation – Future-proof your infrastructure with the latest Very Small Form Factor technology.
Key Advantages
1. Ultimate Density (VSFF Design): Enables triple the fiber count in the same rack unit (RU), significantly reducing data center real estate costs.
2. Elite Optical Performance: The Single-Mode Elite (APC) green housing ensures ultra-low insertion loss (IL) and superior return loss (RL), critical for error-free high-speed data transmission.
3. DirectConec™ Push-Pull Mechanism: The 28mm (1.10") boot allows for high-density "chimney" patching without the need for extraction tools, simplifying maintenance in congested panels.
4. Advanced TMT Ferrule: Built on proven MT mechanical alignment technology, ensuring long-term connection stability and reliability under high-bandwidth workloads.
5. Flexible Compatibility: Optimized for Ø 1.6mm to 2.0mm (0.06" - 0.08") round micro-cables, providing a robust termination for modern structured cabling.
Application Scenarios
1. AI/Machine Learning Clusters: High-density interconnects between GPU nodes and leaf switches.
2. Hyperscale Data Centers: Core-to-Spine distribution where rack space optimization is paramount.
3. 800G / 1.6T Transceiver Patching: Ideal for OSFP and QSFP-DD breakout applications.
4. Optical Distribution Frames (ODF): Maximizing port count in limited telecommunication room footprints.
Why Choose KEXINT?
As a specialist in high-end optical connectivity, KEXINT ensures every MMC kit undergoes rigorous factory testing. We provide:
OEM/ODM Customization: Neutral branding available for source-factory positioning on platforms like Alibaba.
Technical Support: US engineering terminology and dual-unit documentation for seamless project integration.
Quality Assurance: 100% compatibility with US Conec MMC components and industrial standards.
Specification
| Specification Item | Metric Data | Imperial Data | AI Infrastructure Value |
| Connector Type | MMC Male (Senior/Pinned) | MMC Male (Pinned) | Essential for Trunk-to-Patchcord linking |
| Fiber Count | 12-Fiber | 12-Fiber | Standard 8-fiber or 12-fiber lane support |
| Fiber Type | Single-Mode OS2 Elite | SM OS2 Elite | Ultra-low IL for 800G Coherent links |
| Housing Color | Green (APC) | Green (APC) | Immediate visual ID for Elite performance |
| Boot Style | 28mm Push-Pull | 1.10" Push-Pull | Tool-less operation in high-density zones |
| Cable OD Suitability | Ø 1.6mm - 2.0mm | Ø 0.06" - 0.08" | Compatible with ultra-slim micro-cables |
| Operating Temp | -40°C to +75°C | -40°F to +167°F | Reliable in high-heat AI environments |
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