VSFF

KEXINT introduces the MMC Male Single-Mode Elite Connector Kit, a cutting-edge Very Small Form Factor (VSFF) solution engineered to meet the extreme density requirements of next-generation AI data centers and 800G optical networks. This kit, fully compatible with the US Conec MMC platform (P/N 24890), features advanced 12-fiber TMT ferrule technology that delivers three times the cabling density of standard MTP®/MPO connectors.Designed with a high-performance Green Housing to signify Single-mode Elite specifications, it ensures ultra-low insertion loss and high return loss for critical high-speed links. The integration of the 28mm DirectConec™ Push-Pull boot allows for effortless insertion and removal in ultra-high-density patch panels where finger access is limited, eliminating the need for specialized extraction tools. Whether you are scaling an AI/ML cluster or upgrading hyperscale infrastructure, the KEXINT MMC kit provides the mechanical reliability and optical precision needed to solve I/O bottlenecks and maximize rack-space ROI. Its robust design is optimized for Ø 1.6mm to 2.0mm round cables, making it the ideal choice for high-density trunking and structured cabling environments.