I-KEXINT

Lesi sihloko sihlaziya ngokujulile izinselele zokushabalaliswa kokushisa, isikhala se-rack ebonakalayo, kanye ne-bandwidth enkulu ebhekene nezikhungo zedatha ze-hyperscale ze-800G/1.6T esikhathini sokubala se-AI, futhi sethula ngokuhlelekile i-KEXINT's Total Ultra-High-Density Physical Layer Connectivity Solutions. Iphothifoliyo yethu esezingeni eliphezulu inezixhumi ze-SN®/VSFF ezincane kakhulu (usayizi we-LC yendabuko ongu-1/3 kuphela), izinhlelo zekhebula ze-trunk ezine-16F/24F MPO-PLUS ezine-high-loss low-loss, izintambo ze-patch ezihlakaniphile ezinemikhono ye-ID yezinombolo engu-01-08 eqinile, kanye nama-adapter okuhlola e-Loopback ane-high-precision anombala ophindwe kabili ukuze kuqaliswe ngokushesha izixhumanisi. Yakhiwe ngemicu yezinga lomhlaba njenge-YOFC, zonke izingxenye ze-KEXINT zidlula ku-100% factory 3D interferometry kanye nokuhlolwa okuqinile kokunciphisa, okusekelwa yizincazelo zobuchwepheshe zobungcweti. Ihambisana ngokugcwele nezindinganiso ze-"NVIDIA Quantum-3" kanye ne-"800G-DR8 Ready", lesi sixazululo esinobungani nokugeleza komoya sikhulisa ubuningi be-rack ngo-300% futhi sinciphisa isikhathi sokungasebenzi kwesevisi, okwenza kube ukukhetha okuhamba phambili, okungenazingozi kwabaqhubi bezokuxhumana bomhlaba wonke kanye namaqoqo e-AI asezingeni eliphezulu athuthela kalula kumanethiwekhi e-1.6T.

I-KEXINT yethula i-MMC Male Single-Mode Elite Connector Kit, isisombululo se-Very Small Form Factor (VSFF) esithuthukisiwe ukuze sihlangabezane nezidingo zobuningi obukhulu bezikhungo zedatha ze-AI zesizukulwane esilandelayo kanye namanethiwekhi e-optical angu-800G. Le khithi, ehambisana ngokugcwele nepulatifomu ye-US Conec MMC (P/N 24890), ifaka ubuchwepheshe obuthuthukisiwe be-12-fiber TMT ferrule obunikeza ubuningi bezintambo obuphindwe kathathu kunezixhumi ze-MTP®/MPO ezijwayelekile. Yakhelwe nge-Green Housing esebenza kahle kakhulu ukuze ibonise imininingwane ye-Single-mode Elite, iqinisekisa ukulahlekelwa kokufakwa okuphansi kakhulu kanye nokulahlekelwa okuphezulu kokubuya kwezixhumanisi ezibalulekile zesivinini esikhulu. Ukuhlanganiswa kwebhuthi ye-28mm DirectConec™ Push-Pull kuvumela ukufakwa nokususwa okulula kumaphaneli e-patch aphezulu kakhulu lapho ukufinyelela kweminwe kunqunyelwe khona, kususa isidingo samathuluzi okukhipha akhethekile. Kungakhathaliseki ukuthi ukhulisa i-AI/ML cluster noma uthuthukisa ingqalasizinda ye-hyperscale, ikhithi ye-KEXINT MMC inikeza ukuthembeka komshini kanye nokunemba kokukhanya okudingekayo ukuxazulula izinkinga ze-I/O nokwandisa i-ROI yesikhala se-rack. Umklamo wayo oqinile wenzelwe izintambo eziyindilinga ze-Ø 1.6mm kuya ku-2.0mm, okwenza kube ukukhetha okuhle kakhulu kwezindawo zokubopha ezinobukhulu obukhulu kanye nezindawo zokubopha ezihlelekile.