A high-tech enterprise specializing in the research and development of optical fiber communications and manufacturing.
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A high-tech enterprise specializing in the research and development of optical fiber communications and manufacturing.
Product Description
Mellanox MMS4A00 Compatible 1.6T OSFP224 2xDR4/DR8 8x200G PAM4 InfiniBand XDR Optical Transceiver Module(SMF, 1310nm, 500m, Dual MPO-12/APC, DOM, IHS/Closed Finned Top)
The NVIDIA/Mellanox MMS4A00 (980-9IAH1-00XM00) Compatible OSFP Optical Transceiver is a twin-port OSFP IHS/Closed Finned Top module delivering 2x 800Gb/s (1.6T) for InfiniBand XDR networks. It features a single-mode, silicon photonics–based architecture with eight parallel channels, supporting 2×DR4/DR8 transmission. Each 800G port terminates with a 4-channel MPO-12/APC connector. The module uses 200G-PAM4 electrical modulation and provides reliable short-reach connectivity up to 500 meters over eight single-mode fibers.
Built with a Broadcom 3nm DSP, this transceiver ensures ultra-low bit error rates and stable, high-speed data delivery in high-density deployments. Its IHS/Closed Finned Top design enables effective thermal management for Quantum-X800 switches, supporting both air- and liquid-cooled configurations. Seamlessly pairing with NVIDIA B300 and DGX systems, the module delivers scalable, low-latency GPU-to-GPU and GPU-to-storage connectivity, ideal for AI, HPC, and large-scale data center interconnects, unlocking the full potential of high-performance computing fabrics..
Note: "Finned-top" transceivers are now called "Integrated HeatSink" (IHS) as the cooling fins are integrated into the OSFP connector metal top and commonly used in air-cooled switches. "Flat-top" transceivers are now called "Riding Heat Sink" (RHS) as the cooling fins ride on top of the network card or systems internal cages. This is used for both air-cooled and liquid-cooled applications for DGX, ConnectX-7, and BlueField-3 DPUS.
Product Highlights
Built-in Broadcom 3nm DSP Chip, Max. Power Consumption 25W
SiPh-Based Technology for Lower Power, Cost and Higher Density
100% Verified, Compatible with NVIDIA Quantum-X800 Switches
Designed for DGX GB300/B300 Architectures
8x 200G-PAM4 Electrical to Dual 4x 200G-PAM4 Optical Parallel
Interoperates with OSFP224-DR4-800G-FL for 2x 800G NIC
Compliant with Hot Pluggable OSFP MSA, IEEE 802.3dj and RoHS
Class 1 Laser Safety Compliant and DDM Supported
Specifications
| Mellanox InfiniBand Compatible | MMS4A00 | Vendor Name | KEXINT |
| Form Factor | Twin-port OSFP IHS/Closed Finned Top | Max. Data Rate | 1600Gbps (8x 200Gbps) |
| Wavelength | 1310nm | Max. Cable Distance | 500m |
| Connector | Dual MTP/MPO-12 APC | Media | SMF |
| Transmitter Type | CW (SiPh Based) | Receiver Type | PIN |
| TX Power | -3.3~4dBm | Minimum Receiver Power | -6.3dBm |
| Power Budget | 3dB | Receiver Overload | 4dBm |
| Max. Power Consumption | 25W | Extinction Ratio | 3.5dB |
| DDM/DOM | Supported | Commercial Temperature Range | 0 to 70°C (32 to 158°F) |
| Modulation (Electrical) | 8x 200G-PAM4 | Modulation (Optical) | Dual 4x 200G-PAM4 |
| CDR (Clock and Data Recovery) | TX & RX Built-in DSP | Inbuilt FEC | Yes |
| Packaging Technology | COB (Chip on Board) Packaging | Bit Error Ratio (BER) | 6E-12 (FEC Enabled) |
| Protocols | OSFP MSA, CMIS 5.1, IEEE P802.3dj, OIF 224G-VSR | Warranty | 1 Years |
Connectivity Solutions
1.6T to 2x 800G for DGX B300
1.6T to 2x 800G for Switch-Adapter Card
1.6T to 1.6T for Switch-Switch
Features
Boosting B300 AI Cluster Performance with 1.6T OSFP224 Modules
In the NVIDIA B300 architecture, the 1.6T OSFP optical module provides high-bandwidth, low-latency connectivity between Quantum-X800 InfiniBand switches and DGX B300 servers, ensuring stable, high-speed interconnections, accelerating large-scale distributed AI training, and enhancing overall cluster efficiency. Learn more about the B300 InfiniBand solution.
100% Tested by NVIDIA Environment
The FS 1.6T OSFP DR8 modules are tested on NVIDIA Quantum-X800 original devices to ensure the perfect blend of product performance and reliability. Including hardware compatibility (plugging, unplugging, rebooting), software compatibility (connectivity, parameters). Check compatibility with our Optics-to-Device Compatibility Tool.
Broadcom 3nm DSP & SiPh-Based Technology for Superior Energy Efficiency
Powered by Broadcom's 3nm DSP and silicon photonics chip, this 1.6T XDR transceiver delivers low power consumption of 25W (over 25% power savings) and a tight 6E-12 BER (with FEC Enabled). It enables higher port density, reduced cooling requirements, and lower total cost of ownership.
XDR vs. NDR: Ultra-Large AI Cluster Efficiency Breakthrough
The XDR solution featuring the 1.6T transceiver boosts cluster energy efficiency through high bandwidth density and an optimized link architecture. In 512-node configurations, this solution enables unmatched throughput, advanced scalability, significantly reduced power and space requirements and a 40.52% cut in total costs.
Comprehensive Testing Increases Reliability
Qualified through a rigorous process with advanced equipment to ensure you get high-quality and reliable optics.
Reliable Test Result
Professional testing ensures stable and reliable optics with verifiedhardware and software compatibility, covering connectivity, BER and key operating parameters.
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