Fiber Optic SFP Module
A high-tech enterprise specializing in the research and development of optical fiber communications and manufacturing.
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A high-tech enterprise specializing in the research and development of optical fiber communications and manufacturing.
Elevate your network infrastructure to the pinnacle of AI-driven performance with our 800GBASE-DR4 OSFP224 Transceiver Module, engineered for seamless, 100% plug-and-play compatibility with Mellanox/NVIDIA MMS4A20-XM800. This next-generation optical module is specifically tailored to meet the extreme bandwidth and ultra-low latency demands of InfiniBand XDR and next-generation 800Gbps Ethernet protocols.
Utilizing state-of-the-art 200G PAM4 modulation technology across 4 independent lanes, the module delivers an aggregate bandwidth of 800Gb/s over Single-Mode Fiber (SMF) up to 500 meters via an industry-standard MPO-12/APC interface. Built in either RHS (Riding Heat Sink) or Flat Top form factors, it features advanced thermal dissipation designs crucial for high-density, liquid-cooled, or high-performance air-cooled AI clusters and high-performance computing (HPC) switches (such as the Quantum-X800 series).
Whether you are building massive LLM (Large Language Model) training fabrics or upgrading hyperscale cloud data centers, this XDR optical transceiver offers uncompromised reliability, industrial-grade quality control, and exceptional power efficiency to future-proof your optical networks.
Product Description
NVIDIA/Mellanox MMS4A20-XM800 Compatible 800G OSFP224 DR4 8x 200G PAM4 InfiniBand XDR Optical Transceiver Module (SMF, 1310nm, 500m, MPO-12/APC, DOM, RHS/Flat Top)
The OSFP224-DR4-800G-FL is compatible with NVIDIA/Mellanox MMS4A20-XM800 and is designed for next-generation InfiniBand XDR and high-speed data center interconnect. The 800G DR4 transceiver operates at 200Gb/s per lane with 4x 200Gb/s PAM4 modulation, supporting transmission distances of up to 500 meters, making it ideal for short-reach intra–data center deployments. It complies with OSFP MSA, CMIS Rev 5.2, IEEE 802.3dj, and OIF 224G-VSR standards. The built-in digital diagnostics monitoring (DDM) allows access to real-time operating parameters.
Featuring an advanced Broadcom 3nm DSP and silicon photonics technology, the module delivers ultra-low BER, strong signal integrity, and high link reliability at 800G speeds while improving integration density and energy efficiency. It is used to link the Quantum-X800 QM3x00 switches with twin-port OSFP 2x800Gb/s transceivers to dual 800Gb/s ConnectX-8 mezzanine cards in DGX B300/GB300 liquid-cooled AI systems or ConnectX-8 PCIe cards.
Note: "Finned-top" transceivers are now called "Integrated HeatSink" (IHS) as the cooling fins are integrated into the OSFP connector metal top and commonly used in air-cooled switches. "Flat-top" transceivers are now called "Riding Heat Sink" (RHS) as the cooling fins ride on top of the network card or systems internal cages. This is used for both air-cooled and liquid-cooled applications for DGX, ConnectX-7, and BlueField-3 DPUS.
Product Highlights
Built-in Broadcom 3nm DSP Chip, Max. Power Consumption 16W
SiPh-Based Technology for Lower Power, Cost and Higher Density
Verified 100% Compatible with NVIDIA ConnectX-8 NICs
Designed for DGX GB300/B300 Architectures
4x 200G-PAM4 Electrical to 4x 200G-PAM4 Optical Parallel
Interoperates with OSFP-DR8-1.6T for NVIDIA Quantum-X800 Switch
Compliant with Hot Pluggable OSFP MSA, CMIS Rev 5.2 and RoHSClass 1 Laser Safety Compliant and DDM Supported
Specifications
| Mellanox InfiniBand Compatible | MMS4A20-XM800 | Vendor Name | KEXINT |
| Form Factor | Single-port OSFP RHS/Flat Top | Max. Data Rate | 850Gbps (4x 212.5Gbps) |
| Wavelength | 1310nm | Max. Cable Distance | 500m |
| Connector | MPO-12/APC | Media | SMF |
| Transmitter Type | CW (SiPh-Based) | Receiver Type | PIN |
| TX Power | -3.3~4dBm | Minimum Receiver Power | -6.3dBm |
| Power Budget | 3dB | Receiver Overload | 4dBm |
| Max. Power Consumption | 16W | Extinction Ratio | 3.5dB |
| DDM/DOM | Supported | Commercial Temperature Range | 0 to 70°C (32 to 158°F) |
| Modulation (Electrical) | 4x 200G-PAM4 | Modulation (Optical) | 4x 200G-PAM4 |
CDR (Clock and Data Recovery) | TX & RX Built-in DSP | Inbuilt FEC | Yes |
| Packaging Technology | COB (Chip on Board) Packaging | Bit Error Ratio (BER) | 1E-12(FEC Enabled) |
| Protocols | OSFP MSA, CMIS Rev 5.2, IEEE 802.3dj, OIF 224G-VSR | Warranty | 1 Year |
Connectivity Solutions
1.6T to 2x 800G for DGX B300
1.6T to 2x 800G for Switch-Adapter Card
Features
Boosting B300 AI Cluster Performance with 800G OSFP224 Modules
In the NVIDIA B300 architecture, the 800G OSFP224 optical module provides high-bandwidth, low-latency connectivity between Quantum-X800 InfiniBand switches and DGX B300 servers, ensuring stable, high-speed interconnections, accelerating large-scale distributed AI training, and enhancing overall cluster efficiency. Learn more about the B300 InfiniBand solution.
Broadcom 3nm DSP & SiPh-Based Technology for Superior Energy Efficiency
Powered by Broadcom's 3nm DSP and silicon photonics chip, this 800G XDR transceiver delivers low power consumption of 16W (over 11% power savings) and a tight 1E-12 BER (with FEC Enabled). It enables higher port density, reduced cooling requirements, and lower total cost of ownership, while seamlessly pairing with DGX GB300/B300 to scale smoothly for AI clusters.
XDR vs. NDR: Ultra-Large AI Cluster Efficiency Breakthrough
This XDR solution featuring the 800G OSFP224 transceiver boosts cluster energy efficiency through high bandwidth density and an optimized link architecture. In 512-node configurations, this solution enables unmatched throughput, advanced scalability, significantly reduced power and space requirements, and a 40.52% cut in total costs.
Comprehensive Testing Increases Reliability
Qualified through a rigorous process with advanced equipment to ensure you get high-quality and reliable optics.
Reliable Test Result
Professional testing ensures stable and reliable optics with verified hardware and software compatibility, covering connectivity, BER and key operating parameters.
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