The KEXINT 1U 19'' Ultra High Density MMC Adapter Panel is a cutting-edge connectivity solution engineered specifically for AI-driven data centers, high-performance computing (HPC), and hyperscale networking environments. By integrating 66 units of 4-Port MMC adapters, this panel achieves an industry-leading density of 264 fibers within a single rack unit, significantly maximizing cabinet space efficiency compared to traditional LC/MPO solutions.
Designed for the next generation of VSFF (Very Small Form Factor) architecture, it seamlessly supports MMC-12, MMC-16, and MMC-24 interfaces, making it the ideal choice for 400G, 800G, and even 1.6T networking hardware, such as NVIDIA Quantum-2/3 series switches. The premium OS2 Single Mode performance ensures ultra-low insertion loss and exceptional signal integrity for long-distance high-speed transmission.
To ensure professional-grade deployment, the panel features a robust integrated rear cable manager that simplifies high-density fiber routing, maintains optimal bend radius, and provides a clean, organized infrastructure. Whether you are scaling an AI cluster or upgrading a backbone network, the KEXINT UHD MMC Panel offers the reliability, scalability, and future-proof performance required for today’s mission-critical data demands.
Product Description
66 x 4-Port MMC-12/16/24 OS2 Single Mode Adapters, 1U High 19'' Fiber Patch Panel
The 1U fiber adapter panel is pre-loaded with 66 US Conec's 4-port MMC adapters. Each adapter can accommodate 4 pairs of MMC-12/16/24 male-to-female connectors. Compared to an MTP®/MPO adapter, the MMC adapter offers 4 times the cabling port density, enabling rack-to-rack connectivity with 12 times fewer clicks than required with individual MPO12/8 connectors. The 1U 19'' adapter panel is compatible with any standard EIA 19'' racks or cabinets. The rear cable manager, used with cable ties, can help manage large cables. This panel is suitable for applications in AI, Cloud, and Large Data Centers and 800G+ networks, making them well-suited for next‑generation architectures like near‑packaged optics and co‑packaged optics.
Product Highlights
Space-Saving 1U Design, Mount to Standard EIA 19" Rack Rails
66 4-port MMC Adapters in 1U, Up to 6336 Fibers (MMC-24)
4x MTP®/MPO Port Density, Enabling More Fiber Counts Per Rack Unit
US Conec MMC Adapter Ensures Quality and Reliability
Adapters Feature a Guiderail to Simplify Cable Mating and Accelerate Deployment
Dust Cap Keeps Adapter Interiors Clean and Enables Easy Operation in High-Density Cabling
Built-in Rear Cable Manager for Organized Cable Routing
Purpose-built for AI, Cloud, and Large Data Centers and 800G+ Applications
Specifications
| Functionality | Patching | Shelf Movement | Fixed |
| Rack Units | 1 | Rack Type | Standard EIA 19'' |
| Number of Ports | 66 | Fiber Count | 3168/4224/6336F (MMC-12/16/24) |
| Adapter Type | US Conec MMC | Adapter Color | Green |
| Fiber Mode | OS2 | Material of Plate | Steel, Powder-coated Finish |
| Operating Temperature | -10 to 60 °C | Dimensions (HxWxL) | 1.73''x19''x8.62'' (44x483x219mm) |
| Included | Mounting Screw and Nut Kit | Packaging Quantity | 1 |
| Weight, Net | 1.7 kg (3.75 lbs) | RoHS | Compliant |
Connectivity Solutions

Features
Functional Design for Rapid Deployment
The panel provides easy front and rear cable access to simplify routing and management, while rugged coated steel construction ensures reliable installation and long-term durability.

Enhanced Space Utilization, 4x Density over the MTP®/MPO Format
Ultra-compact design accommodates up to 6,336 fibers (MMC-24) in 1RU, delivering 4x cabling density over MTP®/MPO with 12x fewer mating operations for rack-to-rack connectivity.

MMC Ultra High-Density Design for 800G and Beyond Connectivity
Purpose-built for AI, cloud, and large data centers, the MMC adapter panel delivers ultra-high fiber density for next-generation architectures like near-packaged and co-packaged optics.

MMC Family Lineup
The FS MMC product portfolio covers fiber cables, adapter panels, and individual MMC adapters, supporting high-density deployment in compact spaces with greater flexibility.



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