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A high-tech enterprise specializing in the research and development of optical fiber communications and manufacturing.
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A high-tech enterprise specializing in the research and development of optical fiber communications and manufacturing.
The KEXINT 25517 MMC Elite Female connector is a cutting-edge VSFF (Very Small Form Factor) solution engineered for next-generation ultra-high-density optical interconnects. Leveraging Single-Mode Elite low-loss technology, this connector ensures exceptional signal integrity and minimal insertion loss, making it the ideal choice for 400G, 800G, and 1.6T high-speed transmission environments.
Designed specifically for 2.0-2.5mm round cables, the Jacket Crimp architecture provides superior tensile strength and mechanical stability. The 28mm standard boot is optimized to maintain the critical fiber bend radius while significantly reducing the footprint in congested patch panels. As a robust alternative to traditional MPO connectors, the KEXINT 25517 allows for significantly higher port density in AI Data Centers, High-Performance Computing (HPC) clusters, and core switch deployments. With its precision-engineered green APC housing, it delivers reliable, carrier-grade performance for your most demanding network infrastructure.
Product Description
High-Density Optical Interconnect for 800G/1.6T AI Infrastructure
The KEXINT 25517 is a premium MMC (Multi-fiber Micro Connector) Female kit designed to meet the extreme density requirements of modern AI data centers and Hyperscale environments. As a VSFF (Very Small Form Factor) solution, the MMC connector provides significantly higher port density than traditional MPO/MTP® interfaces, making it a critical component for 400G, 800G, and 1.6T DR4/DR8/PLR4 optical breakout applications.
This kit is engineered for 2.0mm to 2.5mm round cables (approx. 0.078" to 0.098") and features a Jacket Crimp design that ensures superior mechanical cable retention, protecting the fiber from axial pull-out in high-vibration or high-tension environments.
Product Highlights
1. Ultra-High Density VSFF Design As a Very Small Form Factor (VSFF) connector, the MMC interface is significantly smaller than traditional MPO connectors. This allows engineers to effectively triple the port density in standard 1U/2U patch panels, making it the premier choice for space-constrained AI and Hyperscale environments.
2. Elite Low-Loss Performance Tier Equipped with premium Single-Mode Elite ferrules, the KEXINT 25517 ensures a maximum insertion loss of < 0.25 dB. This superior performance is critical for maintaining strict link power budgets in 400G, 800G, and next-generation 1.6T high-speed optical networks.
3. Industrial-Grade Jacket Crimp Mechanism. Specifically engineered for 2.0mm to 2.5mm (0.078" to 0.098") round cables, the specialized Jacket Crimp design provides superior mechanical retention. It ensures maximum cable stability and pull-out protection, meeting the rigorous standards required for carrier-grade infrastructure.
4. Purpose-Built for AI Infrastructure: This connector is optimized for the high-density interconnect requirements of AI GPU clusters and Spine-Leaf architectures. It provides the seamless connectivity needed for OSFP and QSFP-DD 800G transceivers, helping to eliminate I/O bottlenecks in parallel optics.
5. Space-Saving 28mm (1.1") Compact Boot The low-profile 28mm short boot design provides the perfect balance between fiber protection and space efficiency. It minimizes cable congestion, significantly improves airflow in high-density server cabinets, and enables easier handling during maintenance.
Features
1. VSFF (Very Small Form Factor) Evolution
The MMC connector is the next-gen VSFF alternative to the standard MPO. As seen in the comparison, the MMC's drastically smaller footprint allows for significantly higher port density, enabling you to fit more fibers into the same rack space without sacrificing performance.
2. Triple the Density in 1U Racks
Engineered for Hyperscale environments, the MMC design allows for 3x the density of standard MPO/MTP solutions. It is the ultimate solution for 400G/800G/1.6T networks where rack space is at a premium and airflow optimization is critical.
3. Elite-Grade Low Loss Performance
Using Single-Mode Elite ferrules, the KEXINT 25517 kit ensures a maximum insertion loss of <0.25dB. This precision is vital for the low-latency requirements of AI GPU clusters.
4. Push-Pull Tab for High-Density Access
Even in the most congested high-density panels, the integrated Push-Pull tab ensures easy insertion and extraction. This ergonomic feature prevents accidental disconnects and simplifies maintenance.
5. AI Infrastructure & 800G Ready
The KEXINT MMC kit is fully optimized for the NVIDIA-based AI ecosystem. It provides seamless connectivity for OSFP and QSFP-DD 800G transceivers, helping to eliminate bandwidth bottlenecks.
Specification
| Part Number | 25518 |
| Brand | MMC |
| Type | Plug |
| Connector Style | MMC Sr |
| Fiber Type | Single-mode |
| Fiber Count | x12 |
| Gender | Male |
| Housing Color | Green |
| Cable Style | Ø 2.0- 2.5 mm Round |
| Boot Options | DirectConec™ Push-Pull 28mm |
Why Choose Us
Company Profile
Product Description
The KEXINT 25517 is a premium MMC (Multi-fiber Micro Connector) Female kit designed to meet the extreme density requirements of modern AI data centers and Hyperscale environments. As a VSFF (Very Small Form Factor) solution, the MMC connector provides significantly higher port density than traditional MPO/MTP® interfaces, making it a critical component for 400G, 800G, and 1.6T DR4/DR8/PLR4 optical breakout applications.
This kit is engineered for 2.0mm to 2.5mm round cables (approx. 0.078" to 0.098") and features a Jacket Crimp design that ensures superior mechanical cable retention, protecting the fiber from axial pull-out in high-vibration or high-tension environments.
Product Highlights
1. Ultra-High Density VSFF Design As a Very Small Form Factor (VSFF) connector, the MMC interface is significantly smaller than traditional MPO connectors. This allows engineers to effectively triple the port density in standard 1U/2U patch panels, making it the premier choice for space-constrained AI and Hyperscale environments.
2. Elite Low-Loss Performance Tier Equipped with premium Single-Mode Elite ferrules, the KEXINT 25517 ensures a maximum insertion loss of < 0.25dB. This superior performance is critical for maintaining strict link power budgets in 400G, 800G, and next-generation 1.6T high-speed optical networks.
3. Industrial-Grade Jacket Crimp Mechanism Specifically engineered for 2.0mm to 2.5mm (0.078" to 0.098") round cables, the specialized Jacket Crimp design provides superior mechanical retention. It ensures maximum cable stability and pull-out protection, meeting the rigorous standards required for carrier-grade infrastructure.
4. Purpose-Built for AI Infrastructure: This connector is optimized for the high-density interconnect requirements of AI GPU clusters and Spine-Leaf architectures. It provides the seamless connectivity needed for OSFP and QSFP-DD 800G transceivers, helping to eliminate I/O bottlenecks in parallel optics.
5. Space-Saving 28mm (1.1") Compact Boot The low-profile 28mm short boot design provides the perfect balance between fiber protection and space efficiency. It minimizes cable congestion, significantly improves airflow within high-density server cabinets, and allows for easier handling during maintenance.
Features
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