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A high-tech enterprise specializing in the research and development of optical fiber communications and manufacturing.
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A high-tech enterprise specializing in the research and development of optical fiber communications and manufacturing.
The KEXINT 25518 is a premium MMC Elite Male Connector Kit specifically engineered for high-density Single-Mode (SM) fiber optic infrastructures. Featuring a precision-molded Green Housing and a robust Jacket Crimp design, this connector is optimized for Ø 2.0mm to 2.5mm round cables, providing exceptional mechanical stability.
As a Very Small Form Factor (VSFF) solution, it enables up to 3x the fiber density of traditional MPO connectors, making it an essential component for next-generation AI data centers and 800G network deployments. The specialized 28mm short boot design (approx. 1.1") ensures superior cable management in tight-space environments and high-density patch panels. Delivering Elite-grade low insertion loss performance and high reliability, the 25518 kit is the ideal choice for US engineering clients and global ISP providers seeking to future-proof their high-bandwidth optical interconnects.
Product Description
The KEXINT 25518 represents the next generation of Very Small Form Factor (VSFF) optical interconnects. Specifically designed for high-density AI data centers and 800G/1.6T networking environments, this MMC Elite Male Connector Kit offers a revolutionary solution to bandwidth and space constraints. Utilizing the US Conec MMC technology, it provides 3x the fiber density of traditional MPO connectors while maintaining the superior optical performance required for long-reach Single-Mode (SM) applications.
Product Highlights
1. 3x Fiber Density with VSFF Design: Utilizing the Very Small Form Factor (VSFF) design, the MMC connector is only 1/3 the size of a standard MPO. This allows for triple the port density in 1U patch panels, making it the premier choice for space-constrained AI data centers.
2. Elite Grade Low-Loss Performance: Precision-engineered to meet "Elite" grade specifications, this Single-Mode (SM) connector kit ensures ultra-low insertion loss, providing the superior signal integrity required for 400G, 800G, and next-gen 1.6T high-speed networks.
3. Compact 28mm Short Boot (1.1"): The specialized 28mm short boot design significantly reduces the connector's depth. This improves airflow within high-density racks and allows for easier cable routing in narrow-depth enclosures and tight-bend environments.
4. Robust Jacket Crimp for Round Cables: Specifically designed for Ø 2.0mm to 2.5mm round cables, the secure jacket crimp mechanism provides high tensile strength and mechanical stability, ensuring reliable performance in demanding field installations.
5. Future-Proofed for AI Infrastructure: Optimized for High-Performance Computing (HPC) and AI GPU clusters, this MMC kit is compatible with the latest transceiver architectures, helping US and global engineers solve I/O bottlenecks in massive optical interconnects.
Features
1. Elite Grade Performance: Engineered to meet the most stringent "Elite" low-loss specifications, ensuring maximum signal integrity for high-speed transmission.
2. Optimized Space Management: Featuring a specialized 28mm short boot (approx. 1.1"), this kit is ideal for tight-bend environments and high-density patch panels where vertical space is at a premium.
3. Robust Jacket Crimp Design: The secure jacket crimp mechanism is tailored for Ø 2.0mm to 2.5mm round cables, providing enhanced mechanical pull-strength and durability for field installations.
4. VSFF Advantage: As a Very Small Form Factor connector, the MMC footprint allows for significantly increased port density, enabling 1U hardware to support higher fiber counts without compromising cooling or cable routing.
Specification
| Part Number | 25518 |
| Brand | MMC |
| Type | Plug |
| Connector Style | MMC Sr |
| Fiber Type | Single-mode |
| Fiber Count | x12 |
| Gender | Male |
| Housing Color | Green |
| Cable Style | Ø 2.0- 2.5 mm Round |
| Boot Options | DirectConec™ Push-Pull 28mm |
Why Choose KEXINT MMC Solutions?
In the era of AI-driven infrastructure, I/O bottlenecks are the primary challenge for data center scaling. The KEXINT 25518 MMC Elite kit solves this by combining the precision of MT ferrule technology with a significantly smaller footprint.
Future-Proofing: Ready for 800G and 1.6T OSFP/QSFP-DD deployments.
Ease of Integration: The 28mm boot reduces cable congestion by up to 40% compared to standard MPO boots.
Reliability: Precision-molded components ensure repeatable, low-loss connections across thousands of mating cycles.
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